| 摘要 |
PURPOSE: A positive photosensitive polyimide resin composition is provided to ensure excellent photosensitivity, development, residual film rate, and resolution, and to satisfy adhesion to a film, heat resistance, insulating property, and flexibility. CONSTITUTION: A positive photosensitive polyimide resin composition comprises (a) a photoresist including quinone diazide sulfonate of a multivalent phenol compound represented by chemical formula 1, (b) an alkali-developable polyimide resin including a structure unit represented by chemical formula 2 and a structure unit represented by chemical formula 3, and (c) a solvent.
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