| 摘要 |
PURPOSE: A device embedded printed circuit board and a manufacturing method thereof are provided to prevent a solder from flowing between both electrodes in a surface mount process by fixing polymer resin based or organic and inorganic complex between electrode pads. CONSTITUTION: A first electrode pad(120) is formed on a substrate(110). Device fixing materials(130) are formed between the first electrode pads. A first device is fixed to the first electrode pad. An insulation layer and a metal layer(210) are laminated on the substrate. A second electrode pad(220) and a circuit pattern(260) are formed on a surface layer.
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