| 摘要 |
PURPOSE: An apparatus for removing residual is provided to stabilize polishing quality by preventing damages to a wafer. CONSTITUTION: A loading/unloading module(110) loads and unloads a rubber chuck(10). A process module(120) removes the residual and cleans the rubber chuck by providing the chemical. The process module includes a plurality of work units and a holder unit(121). The holder unit grips the rubber chuck and transfers the rubber chuck between the working units.
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