| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting system capable of coping with fail instantly. <P>SOLUTION: When a mounting inspection machine 6 detects the occurrence of fail in electronic components mounted on a printed circuit board, fail data for indicating the fail are transmitted to each apparatus in a mounting system 1 including at least the printing machine 3 and surface mounters 5-1 to 5-3. When the fail is related to an own apparatus, the causes of the fail are analyzed based on the fail data. Each apparatus of the packaging machine 1 performs measures for solving the problem of the fail, thus coping with the fail rapidly. <P>COPYRIGHT: (C)2007,JPO&INPIT |
