| 摘要 |
PURPOSE: A heat sink and a manufacturing method thereof are provided to improve heat dissipation by discharging heat along a heat sink. CONSTITUTION: A substrate(20) includes an insulation layer(21) and a circuit pattern layer(22a). A plurality of penetration holes(23) are formed on the substrate including a heating device(30). A plurality of protrusions(12) are integrated with the heat sink(10) and has the same height as the plurality of penetration holes. The heat sink discharges heat of the heating device. A plurality of protrusions are inserted into the plurality of penetration holes and are contacted with the heating device to discharge heat.
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