| 摘要 |
<p>A method (200) is included for joining two components to form a bond joint (300), where the first component (302) includes a first alloy having a first composition and a first microstructure, and the second component (308) includes a second alloy having a second composition. A sputter material is sputtered (202) onto a bond surface of the first component (302) to form an interlayer (306), the sputter material of the interlayer (306) having a third composition, the interlayer (306) having an initial microstructure, the initial microstructure is a nanocrystalline microstructure or an amorphous microstructure. The interlayer (306) is contacted (204) with a joint surface (316) of the second component (308) to form an assembly, which is subjected to a first pressure, heated (206) to a first temperature to thereby form the bond joint (300), and heated to a second temperature to transform the initial microstructure into the first microstructure. The first microstructure is different from the nanocrystalline microstructure and the amorphous microstructure.</p> |
