<p>PURPOSE: A method for manufacturing a variable resistance memory device is provided to prevent the deterioration of electrical/physical features due to stress in a hot temperature process. CONSTITUTION: A heating electrode(110) is formed on a semiconductor substrate(100). The heating electrode includes nitride of metal whose atomic radius is larger than titanium. A variable resistance material film(120) is formed on the heating electrode. An upper electrode(130) is formed on the variable resistance material film. A barrier film prevents a material from being spread between the upper electrode and the variable resistance material film.</p>
申请公布号
KR20110058031(A)
申请公布日期
2011.06.01
申请号
KR20090114687
申请日期
2009.11.25
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, YOUNG LIM;LEE, JIN IL;AHN, DONG HO;LEE, SI HYUNG;OH, GYU HWAN