| 摘要 |
<p>PURPOSE: A method for transferring a semiconductor package is provided to shorten the transfer time of a semiconductor package by decreasing the transfer distance of a first pickup device and a second pickup device. CONSTITUTION: Semiconductor packages are mounted on a table(S1). The semiconductor packages are picked up by a first pickup device and a second pickup device(S2). The first pickup device and the second pickup device are transferred to the first and second tray areas of the tray(S3). The semiconductor packages are mounted on the first and second tray areas of the tray(S4).</p> |
