P-type alloy bonding of semiconductors using a boron-gold alloy,申请号US19590850348-传众专利搜索

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发明名称	P-type alloy bonding of semiconductors using a boron-gold alloy
摘要
申请公布号	US3211595(A)	申请公布日期	1965.10.12
申请号	US19590850348	申请日期	1959.11.02
申请人	HUGHES AIRCRAFT COMPANY	发明人	BERNSTEIN LEONARD
分类号	B23K35/30;C22C1/02;C22C5/02;C30B31/00;H01L21/00	主分类号	B23K35/30
代理机构		代理人
主权项
地址

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