CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE
摘要
<p>PURPOSE: A core substrate and a manufacturing method thereof are provided to improve heat radiation efficiency by including an inorganic filler with high thermal conductivity. CONSTITUTION: A core substrate comprises an adhesive resin layer(130), a metal sheet(121), and an insulation layer(140,160). The adhesive resin layer includes an inorganic filler. The inorganic filler includes alumina or silica. A metal sheet is embedded in the adhesive resin layer. The insulation layer is laminated on both sides of the adhesive resin layer.</p>
申请公布号
KR20110058113(A)
申请公布日期
2011.06.01
申请号
KR20090114788
申请日期
2009.11.25
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, SANG YOUP;RYU, JOUNG GUL;KIM, DONG SUN;CHOI, JAE HOON;SEO, IN HO;LEE, JOON SUNG