发明名称 CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE
摘要 <p>PURPOSE: A core substrate and a manufacturing method thereof are provided to improve heat radiation efficiency by including an inorganic filler with high thermal conductivity. CONSTITUTION: A core substrate comprises an adhesive resin layer(130), a metal sheet(121), and an insulation layer(140,160). The adhesive resin layer includes an inorganic filler. The inorganic filler includes alumina or silica. A metal sheet is embedded in the adhesive resin layer. The insulation layer is laminated on both sides of the adhesive resin layer.</p>
申请公布号 KR20110058113(A) 申请公布日期 2011.06.01
申请号 KR20090114788 申请日期 2009.11.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, SANG YOUP;RYU, JOUNG GUL;KIM, DONG SUN;CHOI, JAE HOON;SEO, IN HO;LEE, JOON SUNG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址