| 摘要 |
PURPOSE: A light emitting diode package is provided to fuse a lens with a molding unit by an ultrasonic wave to couple tens of lenses with light emitting diode package, thereby drastically reducing manufacturing time. CONSTITUTION: A light emitting diode chip(10) comprises a first electrode(11) and a second electrode(12). A first lead unit(20) is electrically connected to the first electrode of the light emitting diode chip. A second lead unit(30) is electrically connected to the second electrode of the light emitting diode chip. A molding unit(40) integrates the first lead unit with the second lead unit by filing the gap between the first and second lead units. A lens(50) includes a light concentrating unit(51) and a lens protrusion.
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