发明名称 |
VERTICALLY ADJUSTABLE CHEMICAL MECHANICAL POLISHING HEAD HAVING A PIVOT MECHANISM AND METHOD FOR USE THEREOF |
摘要 |
PURPOSE: A vertically adjustable chemical mechanical polishing head with a pivot machine and a method for using the same are provided to eliminate vertical ununiformity on the surface of a substrate by a mechanical buffing combination, thereby forming an extremely flat surface. CONSTITUTION: A retaining ring(220) holds a substrate during a CMP. The retaining ring is combined with an upper housing(215) through a retaining ring adapter(225). A drive flange(240) includes a lower surface coupled with a dome(255) by a ball bearing(250). The dome is coupled with a base flange. The base flange is combined with a sub carrier(260) and a rubber insert(210).
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申请公布号 |
KR20110058752(A) |
申请公布日期 |
2011.06.01 |
申请号 |
KR20110034892 |
申请日期 |
2011.04.14 |
申请人 |
EBARA TECHNOLOGIES INCORPORATED |
发明人 |
SAKURAI KUNIHIKO;MOLONEY GERARD;WANG HUEY MING;LIU JUN;LAO PETER |
分类号 |
H01L21/304;B24B37/00;B24B37/04;B24B37/30;B24B47/22 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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