| 摘要 |
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE THERE IS PROVIDED AN. EPOXY RESINCOMPOSITION FOR ENC APSUL AT I NO 5 A SEMICONDUCTORESSENTIALIYCOMPRISING (A) A PHENOLARALKYL TYPE EPOXY RESIN HAVING A PHENYLENE STRUCTURE, (B) A PHENOLARAIKYL RESIN HAVING A BIPHENYLENE STRUCTURE, (C) A CURING ACCELERATOR CONTAINING AN ADDUCT OF A PHOSPH I NE COMPOUND AND A QUINONE COMPOUND, (D) A COMPOUND IN WHICH HYDROXYL GROUPS ARE ATTACHED TO EACH OF TWO OR MORE ADJACENT 10 CARBON ATOMS OF AN AROMATIC RING, (E) A SILANE COUPLING AGENT AND (F) AN INORGANIC F ILLER, WHEREIN THE INORGANIC FILLER (F) IS CONTAINED IN 84 WTTO 92 WTBOTH INCLUSIVE IN THE TOTAL AMOUNT OF THE EPOXY RESIN COMPOSITION. 15 |
