发明名称 Through-type multilayer capacitor array
摘要 A multilayer capacitor array includes a capacitor body, two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, one first outer connecting conductor, and one second outer connecting conductor, where the capacitor body includes first and second signal inner electrodes, and first to third grounding inner electrodes. The first signal inner electrode is arranged to oppose the first or third grounding inner electrode with at least one insulator layer therebetween, while the second signal inner electrode is arranged to oppose the second or third grounding inner electrode with at least one insulator layer therebetween. The third grounding inner electrode is directly connected to the grounding terminal electrodes, while the first and second grounding inner electrodes are not directly connected to the grounding terminal electrodes, but are connected to the third grounding inner electrode through respective outer connecting conductors.
申请公布号 US7952852(B2) 申请公布日期 2011.05.31
申请号 US20080339463 申请日期 2008.12.19
申请人 TDK CORPORATION 发明人 TOGASHI MASAAKI
分类号 H01G4/005;H01G4/06 主分类号 H01G4/005
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