| 摘要 |
PURPOSE: A semiconductor package is provided to prevent the warpage of a package and solder balls having uneven flatness by easily bonding individual components regardless of the size and thermal expansion of individual component package. CONSTITUTION: In a semiconductor package, a first package(100) comprises a first substrate(110) and a first semiconductor chip(120) which is formed thereon The first semiconductor chip is electrically connected to the first substrate through a bonding wire. A second package(200) comprises a second substrate(210) and a second semiconductor chip(220) which is formed thereon A second semiconductor chip is electrically connected to the second substrate through a bonding wire. An elastic member(160) electrically connects the between first substrate of the first package and the second substrate of the second package.
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