发明名称 |
Performing die-to-wafer stacking by filling gaps between dies |
摘要 |
An integrated circuit structure includes a bottom semiconductor chip; a top die bonded onto the bottom semiconductor chip; a protecting material encircling the bottom die and on the bottom semiconductor chip; and a planar dielectric layer over the top die and the protecting material. The protecting material has a top surface leveled with a top surface of the top die.
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申请公布号 |
US7951647(B2) |
申请公布日期 |
2011.05.31 |
申请号 |
US20080140695 |
申请日期 |
2008.06.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YANG KU-FENG;CHIOU WEN-CHIH;WU WENG-JIN;SUNG MING-CHUNG |
分类号 |
H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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