发明名称 Bonding agent sticking inspection apparatus, mounting apparatus, and method of manufacturing electrical component
摘要 A bonding agent sticking inspection apparatus includes a photographing section, a movement section, and a control section. The photographing section photographs an image of a substrate. The image includes a sticking expected range indicating a range in which a bonding agent should be positioned. The control section controls the photographing section and the movement section, sets an inspection region having a width equal to the pitch between electrodes in an entire edge part in a direction in which the electrodes are arranged in a peripheral edge part of the sticking expected range in the image, detects a ratio of a nicked part of the bonding agent to the inspection region, and judges whether or not an abnormality is present in the bonding agent on the basis of a comparison between the ratio of the nicked part and a threshold set in advance.
申请公布号 US7952713(B2) 申请公布日期 2011.05.31
申请号 US20080209637 申请日期 2008.09.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOBAYASHI DAISUKE
分类号 G01B11/00 主分类号 G01B11/00
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