发明名称 Method for fabricating semiconductor device
摘要 First, on a semiconductor region of a first conductivity type, a trapping film is formed which stores information by accumulating charges. Then, the trapping film is formed with a plurality of openings, and impurity ions of a second conductivity type are implanted into the semiconductor region from the formed openings, thereby forming a plurality of diffused layers of the second conductivity type in portions of the semiconductor region located below the openings, respectively. An insulating film is formed to cover edges of the trapping film located toward the openings, and then the semiconductor region is subjected to a thermal process in an atmosphere containing oxygen to oxidize upper portions of the diffused layers. Thereby, insulating oxide films are formed in the upper portions of the diffused layers, respectively. Subsequently, a conductive film is formed over the trapping film including the edges thereof to form an electrode.
申请公布号 US7951679(B2) 申请公布日期 2011.05.31
申请号 US20050187958 申请日期 2005.07.25
申请人 PANASONIC CORPORATION 发明人 YOSHIDA KOJI;TAKAHASHI KEITA;NORO FUMIHIKO;ARAI MASATOSHI;TAKAHASHI NOBUYOSHI
分类号 H01L21/336 主分类号 H01L21/336
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