Device for manufacturing material disk, has wire saw comprising parallel saw wires clamping saw grid, where plane of saw grid and material plane of material block separated from wire saw or holding plane enclosing angle

摘要

The device has a holding device (12) for a material block (10) i.e. silicon block. A wire saw (18) comprises parallel saw wires clamping a saw grid (16). A plane (22) of the saw grid and a material plane (24) of the material block separated from the wire saw or a holding plane (26) enclose an angle (28) different from 0 degree. The holding device has holding sections (20) engaged at the material block. The holding sections lie transverse to a cutting direction of the wire saw. An extraction device is provided adjacent to the material block and the wire saw.