发明名称 |
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTION STRUCTURE |
摘要 |
<p>THERE ARE PROVIDED AN ADHESIVE FOR CONNECTING A CIRCUIT TO BE INTERPOSED BETWEEN SUBSTRATES HAVING CIRCUIT ELECTRODES THEREON OPPOSED TO EACH OTHER AND TO ELECTRICALLY CONNECT THE CIRCUIT ELECTRODES ON THE SUBSTRATES OPPOSED TO EACH OTHER TO THE PRESSURIZING DIRECTION UNDER PRESSURE, WHEREIN THE ADHESIVE CONTAINS A COMPOUND HAVING AN ACID EQUIVALENT OF 5 TO 500 KOH MG/G, AND AN ADHESIVE FOR CONNECTING A CIRCUIT TO BE INTERPOSED BETWEEN SUBSTRATES HAVING CIRCUIT ELECTRODES OPPOSED TO EACH OTHER TO THE PRESSURIZING DIRECTION UNDER PRESSURE, WHEREIN THE ADHESIVE COMPRISES A FIRST ADHESIVE LAYER AND A SECOND ADHESIVE LAYER, AND A GLASS TRANSITION TEMPERATURE OF THE FIRST ADHESIVE LAYER AFTER PRESSURE CONNECTION IS HIGHER THAN THE GLASS TRANSITION TEMPERATURE OF THE SECOND ADHESIVE LAYER AFTER PRESSURE CONNECTION.</p> |
申请公布号 |
MY143567(A) |
申请公布日期 |
2011.05.31 |
申请号 |
MY2001PI01930 |
申请日期 |
2001.04.25 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
SATOYUKI NOMURA;TOHRU FUJINAWA;HIROSHI ONO;HOKO KANAZAWA;MASAMI YUSA |
分类号 |
C09J9/02;C08L61/00;C09J7/00;H01L21/60;H05K3/32;H05K3/36 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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