| 摘要 |
PURPOSE: A semiconductor device is provided to improve the insulating property and voltage resistance between wire layers in which two wire layers are inserted. CONSTITUTION: In a semiconductor device, a first insulation layer(11) is formed on a substrate(10). A first wiring(12), a second wiring(13), and a metal layer(14) are formed on the first insulation layer. A second insulation layer(15) and a third insulation layer(16) are laminated in order to cover the wirings and the metal layer. The second electrode is formed on the third insulation layer. A fourth insulating layer(18) is formed through coating using the insulating material including a solvent. |
