发明名称 |
PLASMA ENHANCED CYCLIC DEPOSITION METHOD OF METAL SILICON NITRIDE FILM |
摘要 |
PURPOSE: A plasma-enhanced cyclic deposition method of a metal silicon nitride film is provided to enable the metal silicon nitride film to be formed using a cyclic deposition method under a plasma atmosphere. CONSTITUTION: A plasma-enhanced cyclic deposition method of a metal silicon nitride film comprises next steps. Metallic amid in a steam state is put into a reactor under a plasma atmosphere and makes compound deposited on a heated substrate. Non-reactive metallic amid is removed by purge. Silicon precursor in a steam state is put into a reactor under a plasma atmosphere and couples the deposited metallic amid to the silicon precursor. Non-reactive silicon precursor is removed by purge.
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申请公布号 |
KR20110056461(A) |
申请公布日期 |
2011.05.30 |
申请号 |
KR20110037993 |
申请日期 |
2011.04.22 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
KIM, MIN KYUNG;KIM, MOO SUNG;YANG, SANG HYUN;LEI XINJIAN |
分类号 |
C23C16/34;C23C16/455;C23C16/50 |
主分类号 |
C23C16/34 |
代理机构 |
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主权项 |
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地址 |
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