发明名称 PLASMA ENHANCED CYCLIC DEPOSITION METHOD OF METAL SILICON NITRIDE FILM
摘要 PURPOSE: A plasma-enhanced cyclic deposition method of a metal silicon nitride film is provided to enable the metal silicon nitride film to be formed using a cyclic deposition method under a plasma atmosphere. CONSTITUTION: A plasma-enhanced cyclic deposition method of a metal silicon nitride film comprises next steps. Metallic amid in a steam state is put into a reactor under a plasma atmosphere and makes compound deposited on a heated substrate. Non-reactive metallic amid is removed by purge. Silicon precursor in a steam state is put into a reactor under a plasma atmosphere and couples the deposited metallic amid to the silicon precursor. Non-reactive silicon precursor is removed by purge.
申请公布号 KR20110056461(A) 申请公布日期 2011.05.30
申请号 KR20110037993 申请日期 2011.04.22
申请人 AIR PRODUCTS AND CHEMICALS, INC. 发明人 KIM, MIN KYUNG;KIM, MOO SUNG;YANG, SANG HYUN;LEI XINJIAN
分类号 C23C16/34;C23C16/455;C23C16/50 主分类号 C23C16/34
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