发明名称 PCB FOR MOUNTING LEDS AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A circuit board for mounting an LED and a manufacturing method thereof are provided to improve yield by removing defects in a manufacturing process by omitting an additional LED package combination process. CONSTITUTION: A metal board(10) rapidly discharges heat generated by an LED. A circuit pattern(20) is formed by etching a copper layer stacked on the metal board. A terminal pattern(30) is formed on the edge of the board and is upwardly exposed to receive electricity. A resist layer(50) is formed on the remaining circuit pattern except for the terminal pattern and an LED electrode pattern(40). A dam(60) is formed on the resist layer by printing ink with a preset height.
申请公布号 KR101037508(B1) 申请公布日期 2011.05.26
申请号 KR20100027009 申请日期 2010.03.25
申请人 AN, BOK MAN 发明人 AN, BOK MAN
分类号 H05K1/02;H01L33/00 主分类号 H05K1/02
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