| 发明名称 |
Semiconductor Devices Having Interconnection Structures |
| 摘要 |
An interconnection structure for a semiconductor device may include lower interconnection patterns disposed in a checker board shape and upper interconnection patterns disposed in a checker board shape and connecting two adjacent lower interconnection patterns to each other.
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| 申请公布号 |
US2011121455(A1) |
申请公布日期 |
2011.05.26 |
| 申请号 |
US20100889499 |
申请日期 |
2010.09.24 |
| 申请人 |
SAMSUNG ELECTRICS CO., LTD. |
发明人 |
YOON JOONG-HO;KIM TAEKYUNG;ROH KANG-SUP;KIM JUN-SEOK;LEE EUN-JUNG |
| 分类号 |
H01L23/532;H01L23/52 |
主分类号 |
H01L23/532 |
| 代理机构 |
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