DEPOSITION INHIBITOR COMPOSITION AND METHOD OF USE

摘要

A deposition inhibitor composition includes two compatible solvents. The first solvent has a vapor pressure of at least 10 mm Hg at room temperature and the second solvent has a vapor pressure of less than that of the first solvent. The composition further includes a hydrophilic deposition inhibitor material that is dissolved in the composition. This material is soluble in an aqueous solution that comprises at least 50% by weight of water and has a free acid content of less than 2.5 meq/g. This composition is useful to provide a deposition inhibitor pattern for chemical vapor deposition methods such as an atomic-layer-deposition method for forming a patterned thin film includes applying a hydrophilic deposition inhibitor material to a substrate.