| 摘要 |
A wafer (W) is loaded on a wafer stage (WST1) and unloaded from the wafer stage (WST1), using a chuck member (102) which holds the wafer (W) from above in a non-contact manner. Accordingly, members and the like to load/unload the wafer (W) on/from the wafer stage (WST1) do not have to be provided, which can keep the stage from increasing in size and weight. Further, by using the chuck member (102) which holds the wafer (W) from above in a non-contact manner, a thin, flexible wafer can be loaded onto the wafer stage (WST1) as well as unloaded from the wafer stage (WST1) without any problems. |
