| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting die-bonding film that prevents warping of an adherend by suppressing curing contraction of the film after die bonding, and to provide a dicing die-bonding film. <P>SOLUTION: The thermosetting die-bonding film is used for adhering and fixing a semiconductor element onto an adherend, and comprises at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxy groups in the thermosetting component is in the range of 1.5 to 6. <P>COPYRIGHT: (C)2011,JPO&INPIT |
