| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliable elastic wave device which excellently performs wire-bonding. SOLUTION: The elastic wave device has: a resin base 4 which has an elastic surface wave element 2, a diepad 6 on which the elastic surface wave element 2 is attached through an adhesive material, a plurality of wire-bonding pads 8 which are arranged so as to separate from the diepad 6 and electrically connected to the elastic surface wave element 2, and a connector 12 which electrically connects the diepad 6 to at least one of the plurality of wire-bonding pads 8; and a resin part 18 which is provided on the connector 12. The connector 12 has a concave part 14 which is bent to the side of the resin base 4 on the surface of the diepad 6, and the top part of the concave part 14 is covered with the resin part 18. COPYRIGHT: (C)2011,JPO&INPIT
|
