发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE |
摘要 |
A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.
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申请公布号 |
US2011121435(A1) |
申请公布日期 |
2011.05.26 |
申请号 |
US20090863068 |
申请日期 |
2009.01.09 |
申请人 |
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发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI |
分类号 |
H01L25/00;B32B3/30;C08J3/28;H01L21/50 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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