发明名称 |
ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES |
摘要 |
The anisotropically conductive adhesive composition according to the present invention is an anisotropically conductive adhesive composition to connect a first circuit member where a first circuit electrode is formed on the principal surface of a first substrate and a second circuit member where a second circuit electrode is formed on the principal surface of a second substrate with the first circuit electrode and the second circuit electrode placed opposite, wherein the anisotropically conductive adhesive composition comprises an adhesive and a coated particle where at least part of the surface of a conductive particle is coated with an insulating material containing a polymer electrolyte and an inorganic oxide fine particle. |
申请公布号 |
US2011121243(A1) |
申请公布日期 |
2011.05.26 |
申请号 |
US201113021924 |
申请日期 |
2011.02.07 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKANE NOBUAKI |
分类号 |
H01B1/22;H01B1/12 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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