发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES
摘要 The anisotropically conductive adhesive composition according to the present invention is an anisotropically conductive adhesive composition to connect a first circuit member where a first circuit electrode is formed on the principal surface of a first substrate and a second circuit member where a second circuit electrode is formed on the principal surface of a second substrate with the first circuit electrode and the second circuit electrode placed opposite, wherein the anisotropically conductive adhesive composition comprises an adhesive and a coated particle where at least part of the surface of a conductive particle is coated with an insulating material containing a polymer electrolyte and an inorganic oxide fine particle.
申请公布号 US2011121243(A1) 申请公布日期 2011.05.26
申请号 US201113021924 申请日期 2011.02.07
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TAKANE NOBUAKI
分类号 H01B1/22;H01B1/12 主分类号 H01B1/22
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