发明名称 |
HEAT PUMP TYPE COOLING/HEATING APPARATUS |
摘要 |
<p>PURPOSE: A hot-water supply device of a heat pump type is provided to enhance the temperature of discharged water by the cascade heat exchanger of a low-temperature freezing cycle and a high-temperature freezing cycle and to raise heating performance by injecting vapor refrigerant to the compressor of a low-temperature cycle area or the compressor of a high-temperature cycle area. CONSTITUTION: A hot-water supply device of a heat pump type comprises a cascade cycle unit, a refrigerant injecting path(26), and a gas-refrigerant control valve(30). The cascade cycle unit comprises a cascade heat exchanger(10) and a water-refrigerant heat exchanger(20). The cascade heat exchanger heat-exchanges the first refrigerant of a low-temperature freezing cycle(A) and the second refrigerant of the high-temperature freezing cycle(B). The water-refrigerant heat exchanger condenses the second refrigerant of the high-temperature freezing cycle to heat water. The refrigerant injecting path is branched from between the cascade heat exchanger and the evaporator of the low-temperature freezing cycle to inject refrigerant to the low-pressure compressor of the low-temperature freezing cycle.</p> |
申请公布号 |
KR20110056061(A) |
申请公布日期 |
2011.05.26 |
申请号 |
KR20090112740 |
申请日期 |
2009.11.20 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
CHIN, SIM WON;LEE, EUNG YUL;KIM, BUM SUK;PARK, SANG KYOUNG |
分类号 |
F25B30/02;F25B7/00;F25B41/06;F25B49/02 |
主分类号 |
F25B30/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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