| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an aligner that enables even a wafer having been deformed through a plurality of exposure processes to be highly accurately aligned, and that easily obtains high throughput. <P>SOLUTION: The aligner includes a position detection system having: a lighting system which receives light from a light source and irradiates alignment marks 50a, 50b formed on an object 6 to be measured with the light; and an image-forming system which forms images of light reflected, diffracted, or scattered by the alignment marks 50a, 50b, and the aligner performs at least one of rotation, shifting, and magnification correction on the object 6 to be measured based upon position information on the alignment marks 50a, 50b detected by the position detection system. The image-forming system includes an image detecting element which detects an alignment mark signal from the light, and among measurement regions 70 of the image detecting element, the region in a first direction from the center of rotation of the object 6 to be measured to the alignment marks 50a, 50b is smaller than the region in a second direction orthogonal to the first direction. <P>COPYRIGHT: (C)2011,JPO&INPIT |
