| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite layer formed of an insulating layer having a smooth and uniform surface shape on which smooth and good wiring with an orderly wiring width can be formed, and a wiring (a wiring layer) formed on the insulating layer, and provide a circuit board using the composite layer, and a semiconductor package. SOLUTION: The composite layer formed of the insulating layer and wiring layer includes the wiring (the wiring layer) formed by a printing method on curable insulating resin (the insulating layer) formed on the substrate by the printing method, wherein the wiring contains at least one or more elements out of Cu, Ag, Au, Al, Ni, Co, Pd, Sn, Pb, In, and Ga. COPYRIGHT: (C)2011,JPO&INPIT |
