发明名称 |
ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE |
摘要 |
An electronic device includes a printed circuit board and a heat dissipation module. The printed circuit board has a first heat-generating electronic component and a number of second heat-generating electronic components. The heat dissipation module includes a heat sink thermally engaging on the first heat-generating electronic component and an enclosure enclosing the printed circuit board. The heat sink includes a number of fins. The enclosure extends an inner casing to envelop the fins of the heat sink. The enclosure defines a number of slots letting the casing communicate with an exterior of the enclosure. The casing separates the fins from the second heat-generating electronic component.
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申请公布号 |
US2011122578(A1) |
申请公布日期 |
2011.05.26 |
申请号 |
US20100689190 |
申请日期 |
2010.01.18 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
GUAN ZHI-BIN |
分类号 |
H05K7/20;H01L23/367 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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