发明名称 |
Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung |
摘要 |
<p>The arrangement has a power diode (10), a connecting device and a metal shaped body (20) for heat dissipation. A housing has a main surface facing the metal shaped body, and another main surface that is electrical conductively connected with a contact device (32) of the connecting device. A housing (40) surrounds the diode and closes the diode by using a sealing device for the metal shaped body and the connecting device, where the housing is made of an isolating plastic. A pressure device (50) induces pressure on the housing or connecting device in the direction of the metal shaped body.</p> |
申请公布号 |
DE102006014145(B4) |
申请公布日期 |
2011.05.26 |
申请号 |
DE20061014145 |
申请日期 |
2006.03.28 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
HEILBRONNER, HEINRICH |
分类号 |
H01L23/48;H01L23/10;H01L23/40 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|