发明名称 Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung
摘要 <p>The arrangement has a power diode (10), a connecting device and a metal shaped body (20) for heat dissipation. A housing has a main surface facing the metal shaped body, and another main surface that is electrical conductively connected with a contact device (32) of the connecting device. A housing (40) surrounds the diode and closes the diode by using a sealing device for the metal shaped body and the connecting device, where the housing is made of an isolating plastic. A pressure device (50) induces pressure on the housing or connecting device in the direction of the metal shaped body.</p>
申请公布号 DE102006014145(B4) 申请公布日期 2011.05.26
申请号 DE20061014145 申请日期 2006.03.28
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 HEILBRONNER, HEINRICH
分类号 H01L23/48;H01L23/10;H01L23/40 主分类号 H01L23/48
代理机构 代理人
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