| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition being useful for transfer molding or the like, being excellent in heat-resistance for a long period of time in sealing use in an electronic part requiring high heat-resistance such as a power device and capable of enhancing reliability as a device. SOLUTION: In the thermosetting resin composition containing the following (A)-(C) as indispensable components, a content ratio of component (C) is set to a range of 10-900 pts.wt. relative to 100 pts.wt. of the total amount of component (A) and component (B). (A) A branched polymer compound having a specific structure and having two or more of epoxy groups in one molecule. (B) A branched polymer compound having a specific structure and having two or more of phenolic hydroxyl groups in one molecule. (C) An aromatic propenyl compound having two or more of propenyl groups in one molecule. COPYRIGHT: (C)2011,JPO&INPIT
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