DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a device substrate wherein, since an insulating layer (60) having a terminal section (24) formed on the surface is formed over the entire surface of a glass substrate (20), excluding a display section, the boundary portion (outer circumferential portion) of the insulating layer (60) does not reach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). Therefore, the terminal section (24) is prevented from breaking due to peeling of the insulating layer (60) from the boundary portion, said peeling being caused by the NCF (81). Furthermore, the terminal section (24) and a bump electrode (40a) are constantly pressure-bonded to each other by means of the elastic force of the insulating layer (60), and are electrically stably connected to each other.