| 摘要 |
PROBLEM TO BE SOLVED: To structure a coolant chamber accurately without generating inconvenient deformation on a substrate even through an assembling process in conjunction with heat treatment of a power conversion circuit part without depending on a shape and arrangement of a heat radiation projection in order to improve cooling performance in manufacturing a power semiconductor module in which a power conversion circuit is formed on a metal-insulating layer bonded substrate and a liquid-cooling type cooling device is structured on a metal base side. SOLUTION: The metal-insulating layer bonded substrate 1 formed by bonding a ceramic insulating layer on one surface of an aluminum metal base 10 and bonding a conductor pattern on the insulating layer is used as a circuit board of the power semiconductor module. The metal base is structured by integrally forming a plate-like base part 10a with the insulating layer bonded, the heat radiation projection 10b projecting from a surface opposite to a surface to which the insulating layer of the base part is bonded, a peripheral wall part 10c vertically arranged on the base part and surrounding the heat radiation projection. Thereby, rigidity of the substrate is improved to withstand thermal stress. COPYRIGHT: (C)2011,JPO&INPIT |
