| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connecting member having excellent processability in cutting out processing without causing crack, a circuit member connecting structure formed by using the circuit connecting member and an adhesive composition as a forming material of the circuit connecting member. SOLUTION: The adhesive composition includes (A) an acrylonitrile-butadiene-modified epoxy resin, (B) an epoxy group-containing compound except (A) the acrylonitrile-butadiene-modified epoxy resin, (C) a curing agent and (D) a conductive particle. The circuit connecting member is formed by making the adhesive composition into a semi-cured state. Preferably the circuit connecting member has a filmy shape and the conductive particle is orientated in the thickness direction of the film. COPYRIGHT: (C)2011,JPO&INPIT |
