| 摘要 |
A LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and a LED module electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The heatsink slug is provided, on its surface, with a converged ladder-like recess, where the LED module is fixed on a plane deep inside the recess. Thereby, the fluorescent-colloidal-layer covering on the LED module has an increased thickness in a normal direction, making the color-lights emitted from the chips and from the fluorescent colloid in the space and in every direction able to be maintained so as to achieve a better spatial color uniformity.
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