| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal laminate utilizing a polyimide resin which can be adhered in thermocompression bonding conditions of comparatively low temperature (having a low temperature adhesion) and further has high solder heat resistance and high dimensional stability. <P>SOLUTION: The metal laminate is constituted of a metal layer and a resin layer, the resin layer includes at least one layer including a hardened matter of hyper-brunched polyimide having both thermoplasticity and a thermosetting property, the hyper-brunched polyimide including a triamine unit and a tetracarboxylic acid dianhydride unit. Preferably the triamine unit is derived from triamine shown by following structural formula (formula 1) [wherein X1, X2, X3 may be the same or different from each other and are selected from a group consisting of direct bonding, -O-, -S-, -CO-, -COO-, -C(CH<SB>3</SB>)<SB>2</SB>-, -C(CF<SB>3</SB>)<SB>2</SB>-, -SO<SB>2</SB>- and -NHCO-]. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
