| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a conductive resistance value of an anisotropic conductive connection section from increasing by crushing bumps in the vicinity of a center section in a longitudinal direction of a three-train staggered arrangement at the time of thermocompression bonding in the same manner as bumps on both sides in the longitudinal direction, when a semiconductor chip having the three-train staggered arrangement bumps is connected with an electrode of a printed circuit board in an anisotropic conductive state by using an anisotropic conductive film where a minimum melting viscosity [η<SB>0</SB>] is 1.0×10<SP>2</SP>to 1.0×10<SP>6</SP>Pa sec. <P>SOLUTION: The anisotropic conductive film where conductive particles are dispersed in an insulating adhesive uses conductive particles with a recovery factor of 10-46%. Further, when a minimum melting viscosity of the anisotropic conductive film is set at [η<SB>0</SB>], and a melting viscosity at a temperature T<SB>1</SB>lower by 60°C than a temperature T<SB>0</SB>showing the minimum melting viscosity is set at [η<SB>1</SB>], the anisotropic conductive film satisfies formula (1): 1.0×10<SP>2</SP>Pa sec≤[η<SB>0</SB>]≤1.0×10<SP>6</SP>Pa sec, and formula (2): 1<[η<SB>1</SB>]/[η<SB>0</SB>]≤30. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
