INTEGRATED CIRCUIT DIE, AN INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR CONNECTING AN INTEGRATED CIRCUIT DIE TO AN EXTERNAL DEVICE

摘要

An integrated circuit die comprises an electronic circuit and one or more output ports for outputting signals from the die via an external impedance, to a load, external from the die. The output port is connected to the electronic circuit. The die is further provided with an on-die sampling oscilloscope circuit connected to the output port, for measuring a waveform of the outputted signals.