发明名称 SURFACE-MODIFIED ADHESIVES
摘要 Surface-modified adhesives may be prepared by contacting an adhesive layer to an electrically conductive layer on a releasing substrate and removing the adhesive layer such that at least a portion of the electrically conductive layer adheres to the adhesive surface. The modified adhesive surface becomes an electrically conductive adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.
申请公布号 WO2011063082(A2) 申请公布日期 2011.05.26
申请号 WO2010US57168 申请日期 2010.11.18
申请人 3M INNOVATIVE PROPERTIES COMPANY;HAO, ENCAI,;SHERMAN, AUDREY A.,;SCHAFFER, KEVIN R.,;HENNEN, DANIEL W.,;BAETZOLD, JOHN P.,;PELLERITE, MARK J.,;STEINER, MICHAEL L.,;STRADINGER, JOHN J.,;VANG, KALC C.,;LE, JOHN D.,;KUMAR, KANTA, 发明人 HAO, ENCAI,;SHERMAN, AUDREY A.,;SCHAFFER, KEVIN R.,;HENNEN, DANIEL W.,;BAETZOLD, JOHN P.,;PELLERITE, MARK J.,;STEINER, MICHAEL L.,;STRADINGER, JOHN J.,;VANG, KALC C.,;LE, JOHN D.,;KUMAR, KANTA,
分类号 C09J9/02;C09J7/00 主分类号 C09J9/02
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