发明名称 MANUFACTURING METHOD FOR LED LEAD FRAME
摘要 PURPOSE: A manufacturing method for an LED lead frame is provided to improve the reliability of the quality of a product by performing a hot press of high temperature and high pressure using a high quality of an adhesive sheet. CONSTITUTION: In a manufacturing method for an LED lead frame, an anode terminal(10a) and a cathode terminal(10b) are separated from each other. An adhesive sheet(60) is laminated to cover the anode terminal and the cathode terminal. A reflector(20) is laminated on the adhesive sheet. The anode terminal, the cathode terminal, the adhesive sheet, and the reflector are compressed by high temperature. An opening is formed on the adhesive sheet to correspond to the anode terminal and the cathode terminal. A chip is mounted in a chip mounting unit through the opening.
申请公布号 KR20110056036(A) 申请公布日期 2011.05.26
申请号 KR20090112711 申请日期 2009.11.20
申请人 HIGH TECH., LTD. 发明人 HAN, YONG HEE
分类号 H01L33/62 主分类号 H01L33/62
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