| 摘要 |
<p>PURPOSE: A direct mounting type light emitting unit and manufacturing method thereof are provided to omit a light emitting chip package process, thereby increasing a yield by simplifying processes. CONSTITUTION: A printed circuit board(110) comprises a heat sink(113), an insulation adhesive layer(115), and an electrode(111). A plurality of light emitting chips(120) is electrically coupled with the electrode to irradiate light of a fixed wavelength. The light emitting chips include light emitting diodes which emit blue light or light with an ultraviolet wavelength. A dam board(140) is formed on the printed circuit board. A wavelength converting member(150) converts the wavelength of light radiated from the light emitting chips.</p> |
