发明名称 RESIN AND RESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemically amplified photoresist composition that exhibits good line edge roughness and good mask error factor. <P>SOLUTION: A resin is provided, comprising a structural unit derived from a compound represented by the formula (aa). In formula (aa), T represents a 4-36C alicyclic hydrocarbon group, wherein the hydrogen atom included in the alicyclic hydrocarbon group may be substituted with a halogen atom, a hydroxy group, a 1-12C alkyl group or the like, and the methylene group included in the alicyclic hydrocarbon group is substituted with at least one -SO<SB>2</SB>- and may be optionally substituted with a carbonyl group, an oxygen atom or the like; R<SP>1</SP>represents a hydrogen atom, a halogen atom, or a 1-6C alkyl group which may include a halogen atom; Z<SP>1</SP>represents a saturated hydrocarbon group, wherein -CH<SB>2</SB>- included in the saturated hydrocarbon group may be substituted with -CO-, -O-, -S- or -N(R<SP>c</SP>)-; and R<SP>c</SP>represents a hydrogen atom or a 1-6C alkyl group. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011102380(A) 申请公布日期 2011.05.26
申请号 JP20100139231 申请日期 2010.06.18
申请人 SUMITOMO CHEMICAL CO LTD 发明人 ICHIKAWA KOJI;FUJI YUSUKE;YAMAGUCHI NORIFUMI
分类号 C08F20/38;C08F20/56;G03F7/004;G03F7/039;H01L21/027 主分类号 C08F20/38
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