| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical device suppressing the number of processes and costs for production, and exposing a light receiving surface and a light emitting surface to the outside. <P>SOLUTION: An active region is formed on a first surface of a light transmitting substrate 201, and an optical element 103 created by cutting the light transmitting substrate 201 is adhered to a prescribed position of an adhesive tape 102 to which a lead frame 101 is adhered using a rear surface of the first surface as a bonding surface. After the lead frame 101 and the optical element 103 are electrically connected and the lead frame 101 and the optical element 103 are molded, the adhesive tape 102 is removed. Furthermore, the lead frame 101 is cut, thereby forming a packaged optical device. <P>COPYRIGHT: (C)2011,JPO&INPIT |
