发明名称 |
MANUFACTURING PROCESS FOR A PREPREG WITH A CARRIER, PREPREG WITH A CARRIER, MANUFACTURING PROCESS FOR A THIN DOUBLE-SIDED PLATE, THIN DOUBLE-SIDED PLATE AND MANUFACTURING PROCESS FOR A MULTILAYER-PRINTED CIRCUIT BOARD |
摘要 |
A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.
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申请公布号 |
US2011120630(A1) |
申请公布日期 |
2011.05.26 |
申请号 |
US201113014072 |
申请日期 |
2011.01.26 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
YUASA MAROSHI;HOSOMI TAKESHI;ARAI MASATAKA |
分类号 |
B32B37/10 |
主分类号 |
B32B37/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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