| 摘要 |
Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate (11) including a ground pattern (12) are mounted on a front bezel (BZ1) and a back bezel (BZ2) formed of a conductive material. A ground pattern (12) is arranged between the back bezel (BZ2) and the built-in chassis (CS), and the back bezel (BZ2) includes a claw section (22) for pressing the ground pattern (12) to the built-in chassis (CS). The claw section (22) has elasticity when the claw section is in a linear state, and presses the ground pattern (12) by a leading end (22T) formed by bending an outer periphery.
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